Description of the System

The Agilent 85123A RF parameter extraction test system is specially designed for use with Agilent 85190-series high-frequency IC-CAP software (and a compatible controller) to measure the DC and RF performance of active devices. The software is then used to extract the device model parameters. The standard system uses an Agilent 8753D network analyzer subsystem for S-parameter device characterization, and an Agilent 4142B DC source/monitor to provide precision DC characterization as well as bias for the S-parameter measurements. The Agilent 8753D subsystem consists of the network analyzer with its integrated synthesizer and S-parameter test set, the RF cables, and the calibration kit and verification kit if used.

The integrated synthesizer in a standard Agilent 8753D network analyzer supplies a swept or CW RF signal in the range of 30 kHz to 3 GHz. The integrated test set separates the RF signal into reference and test signals, and provides RF connections via cables and adapters to the external bias networks. The Agilent 4142B source/monitor provides DC force (supply) and sense (measure) capability from its plug-in SMUs (source/monitor units). The DC signals are routed via feedthrough panels to the bias networks, and thus RF and DC signals are applied together to the device under test. The bias networks have 3.5 mm (female) connectors for interface to a test fixture or probe station. The transmitted and reflected signals from the device are measured and displayed by the receiver.

The system can be custom-configured to meet individual needs, for example to provide an optional 6 GHz frequency range, different bias arrangements, or different cabling configurations. The network analyzer can be replaced with an Agilent 8720 (20 GHz) or 8719 (13.5 GHz). Or the system can include instrumentation for different types of measurements, such as power or noise figure measurements.

The system is factory-installed in a rack. A rack-mounted work surface is included, for maximum flexibility and convenience in making on-wafer, in-fixture, or coaxial measurements. The work surface is coated with antistatic material and is connected to chassis ground, therefore a static mat is not required.