Modeled Device Characteristics of the HiSIM2 model
In HISIM 2.4.0, the following device characteristics are included (see "References" #2):
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Reverse Short Channel Effect: impurity pile-up and pocket implant |
Universal
High Field
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Quantum-Mechanical Effect |
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Gate-Poly Depletion Effect |
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Channel Length Modulation |
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Temperature Dependency: |
Thermal Voltage
Band Gap
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Phonon Scattering
Maximum Velocity
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Shallow Trench Isolation: |
Threshold Voltage
Mobility
Leakage Current
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Leakage Currents Modeled: |
1/f
Thermal
Induced Gate
GIDL
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Source/Drain Resistances |
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